Q&A with Ann Kelleher, SVP & GM of Technology Development at Intel on the company's new logic roadmap, lithography, packaging, and process technology (Semiconductor Engineering)
Q&A with Ann Kelleher, SVP & GM of Technology Development at Intel on the company's new logic roadmap, lithography, packaging, and process technology — Five process nodes in four years, high-NA EUV, 3D-ICs, chiplets, hybrid bonding, and more. — Ann Kelleher, senior vice president …
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Q&A with Ann Kelleher, SVP & GM of Technology Development at Intel on the company's new logic roadmap, lithography, packaging, and process technology (Semiconductor Engineering)
![Q&A with Ann Kelleher, SVP & GM of Technology Development at Intel on the company's new logic roadmap, lithography, packaging, and process technology (Semiconductor Engineering)]()
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August 29, 2021
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